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Micrel
PCB Considerations and Layou t
Figure 19 to Figure 23 show the QR219BPF PCB
layout. The Gerber files provided are dow nloa dable
from Micrel Website and contain the remai ning layers
needed to fabricate this board. When copying or
making one’s own boards, make the trace s as short
as possible. Long traces alter the matchin g ne twork
and the values suggested are no lon ger valid.
Suggested matching values may vary due to PCB
variations. A PCB trace 100 mills (2.5mm ) lon g has
about 1.1nH inductance. Optimization sho uld al ways
be done with exhaustive range tests. Make sure the
individual ground connection has a dedicated via
rather then sharing a few of ground points by a single
via. Sharing ground via will increase the ground path
MICRF219
inductance. Ground plane shou ld be solid and with no
sudden interruptions. Avoid usin g ground plane on top
layer next to the matching elem ents. It normally adds
additional stray capacitance which changes the
matching. Do not use Phenolic materials as they are
conductive above 200MHz. Typ ically, FR4 or better
materials are recommended. T he RF path should be
as straight as possible to avoid loops and
unnecessary turns. Separate ground and V DD lines
from other digital or switching po wer circuits (such
microcontroller…etc). Kn own sources of noise should
be laid out as far as possible from the RF circuits.
Avoid unnecessary wide traces which would add more
distribution capacitance (between top trace to bottom
GND plane) and alter the RF parameters.
Figure 19. QR219BPF Top Layer
Figure 20. QR219BPF Bottom Layer
June 2011
20
M9999-060811
(408) 944-0800
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